By Nauman Khan,Soha Hassoun

This ebook explores the demanding situations and provides most sensible recommendations for designing Through-Silicon Vias (TSVs) for 3D built-in circuits.  It describes a singular strategy to mitigate TSV-induced noise, the GND Plug, that is more suitable to others tailored from 2-D planar applied sciences, akin to a bottom flooring aircraft and conventional substrate contacts. The e-book additionally investigates, within the type of a comparative learn, the impression of TSV measurement and granularity, spacing of C4 connectors, off-chip energy supply community, shared and committed TSVs, and coaxial TSVs at the caliber of energy supply in three-D ICs. The authors offer special most sensible layout practices for designing 3D strength supply networks.  considering TSVs occupy silicon real-estate and effect gadget density, this publication presents 4 iterative algorithms to reduce the variety of TSVs in an influence supply community. in contrast to different latest equipment, those algorithms could be utilized in early layout levels while purely practical block- point behaviors and a floorplan can be found. ultimately, the authors discover using Carbon Nanotubes for energy grid layout as a futuristic replacement to Copper.

Show description

Read or Download Designing TSVs for 3D Integrated Circuits (SpringerBriefs in Electrical and Computer Engineering) PDF

Best systems architecture books

Download e-book for iPad: Failure Modes and Mechanisms in Electronic Packages by P. Singh,Puligandla Viswanadham

With the proliferation of packaging know-how, failure and reliability became critical matters. This valuable reference info tactics that allow detection, research and prevention of disasters. It offers a accomplished account of the disasters of gadget programs, discrete part connectors, PCB companies and PCB assemblies.

Download PDF by Peter F. Linington,Zoran Milosevic,Akira Tanaka,Antonio: Building Enterprise Systems with ODP: An Introduction to

The Reference version of Open disbursed Processing (RM-ODP) is a global typical that gives an exceptional foundation for describing and development generally disbursed platforms and functions in a scientific approach. It stresses the necessity to construct those platforms with evolution in brain through determining the troubles of significant stakeholders after which expressing the layout as a chain of associated viewpoints.

Get Embedded Systems for Smart Appliances and Energy Management: PDF

This ebook offers a accomplished advent to embedded structures for shrewdpermanent home equipment and effort administration, bringing jointly for the 1st time a multidisciplinary mixture of themes from embedded platforms, info know-how and gear engineering.  insurance contains demanding situations for destiny source distribution grids, power administration in shrewdpermanent home equipment, micro power iteration, call for reaction administration, ultra-low strength stand by means of, clever standby and conversation networks in domestic and construction automation.

Download e-book for iPad: Memory Controllers for Mixed-Time-Criticality Systems: by Sven Goossens,Karthik Chandrasekar,Benny Akesson,Kees

This booklet discusses the layout and function research of SDRAM controllers that cater to either real-time and best-effort purposes, i. e. mixed-time-criticality reminiscence controllers. The authors describe the state-of-the-art, after which specialise in an structure template for reconfigurable reminiscence controllers that addresses successfully the speedy evolving set of SDRAM criteria, by way of worst-case timing and gear research, in addition to implementation.

Additional resources for Designing TSVs for 3D Integrated Circuits (SpringerBriefs in Electrical and Computer Engineering)

Example text

Download PDF sample

Designing TSVs for 3D Integrated Circuits (SpringerBriefs in Electrical and Computer Engineering) by Nauman Khan,Soha Hassoun

by Richard

Rated 4.10 of 5 – based on 50 votes