By Nauman Khan,Soha Hassoun

This ebook explores the demanding situations and provides most sensible recommendations for designing Through-Silicon Vias (TSVs) for 3D built-in circuits.  It describes a singular strategy to mitigate TSV-induced noise, the GND Plug, that is more suitable to others tailored from 2-D planar applied sciences, akin to a bottom flooring aircraft and conventional substrate contacts. The e-book additionally investigates, within the type of a comparative learn, the impression of TSV measurement and granularity, spacing of C4 connectors, off-chip energy supply community, shared and committed TSVs, and coaxial TSVs at the caliber of energy supply in three-D ICs. The authors offer special most sensible layout practices for designing 3D strength supply networks.  considering TSVs occupy silicon real-estate and effect gadget density, this publication presents 4 iterative algorithms to reduce the variety of TSVs in an influence supply community. in contrast to different latest equipment, those algorithms could be utilized in early layout levels while purely practical block- point behaviors and a floorplan can be found. ultimately, the authors discover using Carbon Nanotubes for energy grid layout as a futuristic replacement to Copper.

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Designing TSVs for 3D Integrated Circuits (SpringerBriefs in Electrical and Computer Engineering) by Nauman Khan,Soha Hassoun


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