By Sung Kyu Lim

This e-book presents readers with quite a few algorithms and software program instruments, devoted to the actual layout of through-silicon-via (TSV) dependent, 3-dimensional built-in circuits. It describes quite a few “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs constructed with the instruments coated within the ebook. This e-book also will characteristic sign-off point research of timing, strength, sign integrity, and thermal research for 3D IC designs. complete info of the similar algorithms should be supplied in order that the readers should be capable not just to understand the middle mechanics of the actual layout instruments, but in addition on the way to reproduce and increase upon the consequences themselves. This publication also will provide a variety of design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) suggestions which are thought of severe to the actual layout process.

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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits by Sung Kyu Lim

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